ES Chamber Solutions

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ES Chamber Solutions

ES Chamber Solutions is the global leader supplier of Refurbished Applied Materials® Equipment, spare parts and Service for the Semiconductor Industry. ES Chamber Solutions offers completely refurbished Applied Materials® Etch, CVD and PVD systems at a significant savings over the cost of a new unit, without sacrificing quality. All of our refurbished systems are guaranteed to meet or exceed the original published manufactured specifications. All of these systems include installation and warranty. ES Chamber Solutions offers can supply many configurations of the Endura 5500, Centura 5200 / 5300 and P5000.
System mainframe types are : RTP (Rapid Thermal Process), DCVD (Dielectric CVD), WCVD (Tungsten CVD), Tungsten Etch Back and Dielectric Etch. This also includes configuring your system to your specific wafer size with a variety of options.
Take a look and see what ES Chamber Solutions offers can offer you.



Endura PVD Processes Endura Chambers Endura System Options
Standard Aluminum (Al) Standard Body Chamber Specific Wafer Size Configuration
Planarized Hot Aluminum Wide Body PVD Chamber Wide or Narrow Body Load Locks
(HTHU) Water Cooled PVD Chamber HP Motorized Lifts
Standard Titanium (Ti) Paste Chamber (Ch-5) Single or Dual Orienter / Degas Chambers
Coherent Titanium (Coh Ti) Preclean I / II chamber HP, HP+ or VHP Robots
Dedicated Titanium Nitride (TiN) Orienter / Degas Chamber Fast Wafer Mapping
Titanium / Titanium Nitride (TTN) PVD Degas Chamber Buffer / Transfer Lid Hoist
Coherent Titanium / Titanium Nitride (Coh TTN) Vectra IMP 3Phase or Enhanced Cryopumps
Titanium Tungsten (TiW) Through-the-Wall or Ballroom Style Installation
Tungsten (W)
Centura Processes Centura Chambers Centura System Options
ASP ASP+ Phase II Mainframe
Sputter Etch Sputter Etch Centura II
Oxide Etch MxP High Temp Mainframe
Poly Etch MxP+ Narrow or Wide Body Loadlock Chambers
Nitride Etch eMxP+ and Super eMxP+ On The Fly Center finder (OTF)
DPS Poly or Metal Etch DPS, R0/R1 Fast Wafer Mapping
HDP-CVD WxP HP, HP+ or VHP Robots
TEOS, Doped / Undoped DxZ Transfer Lid Hoist
WCVD WxZ High Optical Throughput Endpoint System (H.O.T.)
WSiX HDP Monochromator Endpoint
RTP RTP (Mod 1), RTPxe Through the wall or Ballroom Style Installation
PVD Universal CVD
SACVD Preclean II chamber
Orienter / Degas Chamber
Single / Multi Slot Cool Down Chamber
P5000 Processes P5000 Chambers P5000 System Options
ASP ASP Mark II Mainframe
Sputter Etch Mark II 8, 15, or 29 slot storage Elevator
Oxide Etch MxP, MxP+ Phase III Robot and Cassette Handler
Poly Etch MxP+ Poly Phase IV Hotbox
Nitride Etch WxP PLIS
Metal Etch DxZ Wafer Position System (W.P.S.)
TEOS, Doped / Undoped WxZ High Optical Throughput Endpoint System (H.O.T.)
WCVD Universal CVD Monochromator Endpoint
WSiX WCVD Through-the-Wall or Ballroom Style Installation
SACVD Orienter Chamber Standard or Modular Remote Frame

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